互操作性
互连
开放式平台
计算机科学
嵌入式系统
开放标准
频道(广播)
开源
电信
软件工程
操作系统
软件
作者
Debendra Das Sharma,Gerald Pasdast,Zhiguo Qian,Kemal Aygün
出处
期刊:IEEE Transactions on Components, Packaging and Manufacturing Technology
[Institute of Electrical and Electronics Engineers]
日期:2022-09-01
卷期号:12 (9): 1423-1431
被引量:23
标识
DOI:10.1109/tcpmt.2022.3207195
摘要
Universal Chiplet Interconnect Express (UCIe) is an open industry standard interconnect for developing an open chiplet ecosystem, where chiplets from any supplier can be packaged anywhere in an interoperable manner. This article delves into the architectural, circuit, channel, and packaging aspects that we developed that has been adopted in the UCIe 1.0 Specification. We present our results based on our channel and circuit implementation studies.
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