单层
薄脆饼
粒度
材料科学
化学气相沉积
纳米尺度
纳米技术
晶界
光电子学
半导体
拉曼散射
拉曼光谱
冶金
光学
微观结构
物理
作者
Feifei Lan,Ruixia Yang,Kewei Sun,Zenghua Wang,Ying Zhang,Yingmin Wang,Hongjuan Cheng
出处
期刊:Vacuum
[Elsevier]
日期:2022-07-01
卷期号:201: 111091-111091
被引量:8
标识
DOI:10.1016/j.vacuum.2022.111091
摘要
WS2 has gained great attention as atomically thin semiconductors for nanoscale transistors. Wafer scale WS2 films can be obtained by chemical vapor deposition (CVD). But the grain size was only several to tens of micrometers which resulted in a large amount of grain boundaries in the film. The grain boundaries will cause carrier scattering of the film. Wafer scale growth with millimeter grain size is still challenging. In this study, we propose a novel growth method to realize 2-inch continuous monolayer WS2 films with grain size in millimeters. To our knowledge, this is the first report on wafer scale continuous monolayer WS2 films with such grain size. Both Raman mapping and atom force microscope (AFM) imaging reflect a high uniformity of the film. Our research provides an effective way to grow high quality wafer scale continuous monolayer WS2 and other two-dimensional transition metal dichalcogenides (TMDCs) films with large grain size.
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