电子材料
薄脆饼
纳米技术
可伸缩电子设备
弹性体
弯曲分子几何
数码产品
材料科学
机械工程
计算机科学
工程类
电气工程
复合材料
作者
John A. Rogers,Takao Someya,Yonggang Huang
出处
期刊:Science
[American Association for the Advancement of Science (AAAS)]
日期:2010-03-26
卷期号:327 (5973): 1603-1607
被引量:4343
标识
DOI:10.1126/science.1182383
摘要
Recent advances in mechanics and materials provide routes to integrated circuits that can offer the electrical properties of conventional, rigid wafer-based technologies but with the ability to be stretched, compressed, twisted, bent, and deformed into arbitrary shapes. Inorganic and organic electronic materials in microstructured and nanostructured forms, intimately integrated with elastomeric substrates, offer particularly attractive characteristics, with realistic pathways to sophisticated embodiments. Here, we review these strategies and describe applications of them in systems ranging from electronic eyeball cameras to deformable light-emitting displays. We conclude with some perspectives on routes to commercialization, new device opportunities, and remaining challenges for research.
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