Electrochemical double-pulse technique to modulate the roughened surface of copper foil for copper-clad laminates

Single-sided rough copper foils (SSRCFs) applied for copper-clad laminates (CCLs) were fabricated by an electrochemical double-pulse technique. A commercial electrodeposited copper foil was set as the cathode at −1.5 V, and Zn atoms were electrodeposited onto the surface of copper foil. Immediately, the potential was controlled at 0 V, leading to the interdiffusion of Zn and Cu atoms. As the electrode was changed to the anode at 0.5 V, Zn atoms were electrochemically dissolved in electrolyte solution, and the copper-foil surface roughened. After 1125 cycles (3 min), sheet and island topography and pores formed were observed on the surface of the rough side. The prepared SSRCF had a specific surface area of 2.66 m2 g−1, considerably more than that of conventional commercial SSRCFs (1.73 m2 g−1). Using the produced SSRCF to fabricate a CCL, the peel strength was measured to be 2.21 N mm−1. It is believed that this SSRCF has promising applications in high-performance CCLs.