总谐波失真
悬臂梁
声学
微电子机械系统
压电
材料科学
声压
信号(编程语言)
电压
偏压
失真(音乐)
电气工程
光电子学
工程类
物理
计算机科学
CMOS芯片
复合材料
放大器
程序设计语言
作者
Yu‐Chen Chen,Hsu-Hsiang Cheng,Ming-Ching Cheng,Sung-Cheng Lo,Chun-Kai Chan,Weileun Fang
标识
DOI:10.1088/1361-6439/acceb1
摘要
Abstract This study presents the design and realization of a piezoelectric MEMS microspeaker for high-frequency enhancement. Based on piezoelectric thin film actuation, designs of cantilever diaphragms are conducted by modal analysis. Under a die size of 2.5 mm ( w ) × 5 mm ( l ) × 0.4 mm ( t ), the diaphragms are designed to include mid-range and tweeter units with regard to the balance of radiation area and sound pressure contribution. Furthermore, the out-of-phase driving of the proposed device can ensure that the superposition of the sound pressure level (SPL) is within the target frequency range (8–13 kHz) while reducing the SPL outside the target range. In pressure-field measurements, the proposed multi-shape cantilever array can produce high average SPL (91.6 dB) in the target frequency range from 8 kHz to 13 kHz and has a low total harmonic distortion (THD) of <1.4% under a 0.707 V rms input signal. The performance can be further improved by biasing the input signal. With a 9 V bias, the average SPL of the proposed microspeaker in the target frequency range is enhanced to 99.4 dB, and the average THD is reduced to <0.7%. In addition, the THD from 7.7 kHz to 18 kHz is below 2.5%. This study shows the great potential of piezoelectric MEMS microspeakers for in-ear applications.
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