Hybrid laser processes for thick silver coating fabrication on AlN substrate

Aluminum nitride (AlN) are particularly suitable as integrated circuits (ICs) substrates due to its high thermal conductivity and excellent electricity insulation. However, its poor weldability with metals limits its usage. Recent research on surface metallization of AlN provides possible solutions to tackle this defect. Nevertheless, these solutions show some shortages such as complicated processes or insufficient electrical conductivity. In this paper, we report a method that consists of laser induced surface metallization and laser sintering of silver (Ag) coatings. A nanosecond laser was applied to induce a 10 μm thick aluminum (Al) layer from the AlN substrate. Afterwards, laser sintering of Ag layers was implemented, which could enhance the conductivity and the bonding performance between layers. With optimized laser parameters applied, both the electrical conductivity and the bonding tests demonstrated excellent physical properties. Finally, simulation and EDS analysis illustrated the melting evolution and confirmed a metallurgical combination of Al and Ag, thus enhancing bonding strength. Thanks to the small size of focused laser spot, electrical circuits width could be greatly narrowed if these findings were applied; hence highly dense ICs on AlN substrate become potentially available.