Research progress of hybrid bonding technology for three-dimensional integration

Computing power based artificial intelligence will profoundly change the productivity and production relations, and the integrated circuit industry begin to rely on three-dimensional (3D) integration to increase the computing power. The traditional liquid phase welding interconnection can not reconcile the huge difference between devices size and package pitch. Hybrid bonding is a new type of interconnection, through the simultaneous bonding of dielectric layer and metal layer, the interconnection density can be improved by orders of magnitude. In this paper, the research progress of hybrid bonding for 3D integration has been reviewed in detail from the perspectives of materials, equipment and processes. By analyzing the bonding characteristics of metal and dielectric materials, comparing the performance of bonding modules and platforms, detailing the processes of each bonding step, it provides a comprehensive overview and comparison of different research achievements in recent years. In the future, it is urgent to develop the materials, equipment and processes of hybrid bonding collaboratively, which will support the 3D packaging to the aim of small distance, high density and low power consumption.