材料科学
温度循环
造型(装饰)
扫描电子显微镜
微观结构
复合材料
热阻
功率(物理)
结温
有限元法
功率密度
热的
电气工程
汽车工程
结构工程
工程类
气象学
物理
量子力学
作者
Dongjin Kim,Byeongsoo Lee,Tae‐Ik Lee,Seungjun Noh,Chanyang Choe,Se Min Park,Minsu Kim
标识
DOI:10.1016/j.microrel.2022.114652
摘要
This study investigated the power cycling performance on a transfer-molded power module with Cu clip bonding for the next-generation green automotive applications. A 700 V/900A class 2-in-1 half bridge power module was designed and fabricated by using Cu clip bonding and transfer-molding technologies. The switching was precisely controlled so that ton was 0.5 s and toff was 4.5 s by a constant current mode. The condition of the power cycling tests (PCTs) was ∆T = 125 °C with the maximum repetition of 97,000 cycles. The performance and life of the power module was evaluated based on AQG-324, and thermal resistance of the junction (Rth-ja) was monitored during PCTs. The major failure in this investigation was increase in the thermal resistance (Rth). Microstructural integrity of the interconnections were characterized in detail by scanning acoustic tomography (SAT) and interfacial microstructure analysis using a scanning electron microscopy (SEM). The degradation mechanism of the interfacial material was numerically revealed through finite element method (FEM) simulations.
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