材料科学
冶金
焊接
脆性
金属间化合物
粘结强度
钯
镍
润湿
电镀(地质)
复合材料
合金
催化作用
化学
地质学
生物化学
地球物理学
作者
Yen Ngoc Nguyen,Subin Kim,Sung Hwa Bae,Injoon Son
标识
DOI:10.1016/j.apsusc.2021.149005
摘要
In this study, an electroless nickel (EN), electroless palladium (EP), and immersion gold (IG) (ENEPIG) multilayer coat was developed for application on BiTe-based thermoelectric materials to increase the bonding strength between BiTe-based materials and Cu electrodes in thermoelectric modules. The ENEPIG-plated thermoelectric module exhibited a bonding strength of over 11 MPa, which was approximately 40% higher than those of conventional EN-plated modules. According to the interfacial analysis of the bonding areas via a field emission electron probe micro analyzer (FE-EPMA), the Ni layers in ENEPIG and EN acted as diffusion barriers to inhibit the formation of brittle Sn-Te intermetallic compounds (IMCs). Sn-Cu-Pd and Sn-Cu IMCs were formed below the Ni-plated area at the bonding interface of the ENEPIG and EN-plated modules, respectively. However, Sn-Cu-Pd IMCs in the ENEPIG interface exhibited thicker and more homogeneous IMC layers after heat treatment compared to the Sn-Cu IMCs in the conventional EN interface. The wettability of the ENEPIG-plated BiTe surface was significantly greater than that of the EN-plated surface. This directly induced fewer and smaller pores on the bonding interface of the BiTe-based materials with ENEPIG plating compared to those with EN plating, thereby resulting in the higher bonding strength of ENEPIG-plated modules.
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