材料科学
导电油墨
钝化
纳米技术
铜
纳米材料
导电体
聚乙烯吡咯烷酮
制作
成核
化学工程
纳米晶
柔性电子器件
图层(电子)
复合材料
薄板电阻
冶金
高分子化学
有机化学
化学
病理
工程类
替代医学
医学
作者
Xinyan Hu,Gang Li,Pengli Zhu,Jiaoning Tang,Rong Sun,Ching‐Ping Wong
出处
期刊:Nanotechnology
[IOP Publishing]
日期:2019-05-17
卷期号:30 (35): 355601-355601
被引量:11
标识
DOI:10.1088/1361-6528/ab2252
摘要
The inherent susceptibility to oxidation and poor sinterability significantly limit the practical application of Cu-based conductive inks. Most methodologies employed for the inks like organic polymer coatings and inorganic metal deposition are generally ineffective. Herein, we report the design of a novel hierarchical Cu architecture to simultaneously improve the antioxidative and sinterability via a self-passivation mechanism and loose interior structures. The hierarchical Cu architecture was prepared using copper hydroxide, L-ascorbic acid, and polyvinylpyrrolidone in aqueous solution; 40 g Cu were prepared in a scale-up experiment. A possible growth mechanism is proposed, involving the Cu2O-templated and mediated nucleation and growth of Cu nanocrystals, followed by the PVP-directed electrostatic self-assembly of Cu nanocrystals. The synthesized Cu shows high oxidation resistance after stored in ambient environment for 90 d by self-passivation, wherein the dense oxidized external layer prevented further oxidation of Cu, unlike other antioxidative strategies. In addition, the structure became 2D flake after a simple ball-milling for 10 min of 2000r, thus forming a good conductive network at the temperature of 180 °C. Importantly, no obvious decline in the electrical performance after severe surface oxidation. Although the structure cannot offer excellent conductive performance, but it proposes a new solution for the balance of antioxidative capabilities and good sinterability in Cu nanomaterials, thus facilitating greater utilization of Cu-based conductive inks for emerging flexible electronic applications.
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