抵抗
极紫外光刻
材料科学
电子束光刻
光谱学
吸收(声学)
平版印刷术
吸收光谱法
聚合物
分析化学(期刊)
化学
光学
纳米技术
光电子学
有机化学
物理
复合材料
图层(电子)
量子力学
作者
Shinji Yamakawa,Tetsuo Harada,Takeo Watanabe
摘要
Development of new EUV resists is required for next-generation EUV lithography. A resist in which a large amount of photoacid generator (PAG) is introduced into the polymer side chain has been reported as a high-resolution nonchemically amplified negative-tone resist. In this study, we synthesized a new high-PAG loading-type negative-tone resist as a model resist, evaluated EUV sensitivity by flood exposure, and also performed carbon K-edge and sulfur Ledge X-ray absorption spectroscopy (XAS) analysis. The synthesized high-PAG loading bound resist had a 79 mol% PAG unit in the polymer side chain. After the EUV exposure, the resist behaved as a negative-tone resist in the alkaline developer and a positive-tone resist in the organic developer. From the results of the XAS analysis, the possible decomposition mechanisms of the PAG unit in the polymer were estimated.
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