Effect of a novel surfactant on performance of chemical-mechanical polishing solution used for copper with low abrasive content

A kind of multiple amino alcohol nonionic surfactant applied to the chemical-mechanical polishing of copper film was introduced. The effect of the surfactant on the surface tension, viscosity, particle size, and polishing rate of polishing solution and the surface state of polished copper were studied. The basic composition of polishing solution and process parameters are as follows: SiO2 0.5vol%, H2O2 0.5vol%, FA/OII chelating agent 5vol%, working press 2 psi,rotation rate of polishing head 60 r/min, rotation rate of polishing disc 65 r/min, flow rate of polishing solution 150 mL/min, polishing time 3 min, and polishing temperature 21 °C. The results showed that the addition of a trace amount of surfactant can reduce the surface tension and improve the stability of polishing solution markedly, but has slight impact on the viscosity of polishing solution after storage for 24 h. The chemical-mechanical polishing rate as well as the roughness of polished surface are reduced with the increasing of surfactant content in the range of 0%-2%.