材料科学
沸腾
接触角
润湿
核沸腾
铜
传热
气泡
临界热流密度
表面粗糙度
热流密度
传热系数
热力学
表面光洁度
复合材料
机械
冶金
物理
作者
Pulak Sen,Sanjib Kalita,Dipak Sen,Ajoy Kumar Das,Bidyut Baran Saha
标识
DOI:10.1016/j.icheatmasstransfer.2022.106039
摘要
In this work, hydrophobic copper micro-structured (HCM) surfaces are prepared to improve boiling heat transfer. A combination of chemical etching and heat treatment processes is employed to make the bare copper surface hydrophobic in nature. With the modification of wettability, a different micro-structured feature is developed on the surface. The static contact angle of the prepared hydrophobic surface is varied in between 114° to 140°. A saturated pool boiling experiment is conducted at atmospheric pressure by taking distilled water as the boiling fluid. The maximum heat transfer coefficient is 119.7 kW/m2K for the HCM surface with a contact angle of 140°. Due to its hydrophobic nature, the critical heat flux (CHF) of the HCM surfaces is a little smaller than the bare copper surface. Bubble dynamics are also observed during boiling. The surface roughness of the HCM surfaces is enhanced, which increases the active nucleation site of the HCM surfaces. The bubble departure diameter of the HCM surfaces is smaller than the bare copper surface, with a maximum reduction of 45% for the HCM-3 surface. It is also found that the micro-porous surface prepared by a combination of two conventional processes increases the heat transfer substantially.
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