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Slippery Graphene-Bridging Liquid Metal Layered Heterostructure Nanocomposite for Stable High-Performance Electromagnetic Interference Shielding

材料科学 电磁干扰 电磁屏蔽 电磁干扰 石墨烯 光电子学 纳米复合材料 复合材料 异质结 氧化物 纳米技术 电气工程 工程类 冶金
作者
Yue Sun,Xiao Han,Pu Guo,Ziyuan Chai,Jingyi Yue,Yunting Su,Shengda Tan,Xu Andy Sun,Lei Jiang,Liping Heng
出处
期刊:ACS Nano [American Chemical Society]
卷期号:17 (13): 12616-12628 被引量:164
标识
DOI:10.1021/acsnano.3c02975
摘要

Gallium-based liquid metal (LM) with intriguing high electrical conductivity and room-temperature fluidity has attracted substantial attention for its potential application in flexible electromagnetic interference (EMI) shielding. However, the EMI shielding performance of the existing LM-based composites is unsatisfying due to the irreconcilable contradiction between high EMI shielding efficiency (SE) and low thickness. In addition, the research on environmentally stable EMI shielding material has become an urgent need due to the increasingly sophisticated application scenarios. Herein, we prepared a reduced graphene oxide (rGO) bridging LM layered heterostructure nanocomposite with the liquid-infused slippery surface (S-rGO/LM), which exhibits an ultrahigh X-band EMI SE of 80 dB at a mere internal thickness of 33 μm, and an extremely high value of 100 dB at an internal thickness of 67 μm. More significantly, protected by the ultrathin (2 μm) yet effective slippery surface, the S-rGO/LM film exhibits exceptional EMI shielding stability (EMI SE stays above 70 dB) after enduring various harsh conditions (harsh chemical environments, extreme operating temperatures, and severe mechanical wearing). Moreover, the S-rGO/LM film also demonstrates satisfying photothermal behavior and excellent Joule heating performance (surface temperature of 179 °C at 1.75 V, thermal response <10 s), which endows it with the capability of anti-icing/de-icing. This work proposes a way to construct an LM-based nanocomposite with reliable high-performance EMI shielding capability, which shows great potential for applications in wearable devices, defense, and aeronautics and astronautics.
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