Research on crack mechanism and kinetic model of alumina ceramic in the degreasing stage based on stereolithography

Abstract Given that the kinetics of the thermal degreasing process of alumina ceramics based on stereolithography apparatus (SLA) has not been investigated, the mechanism of crack generation is still not fully revealed. This paper aims to elucidate the mechanism of crack generation in the degreasing process of alumina ceramics and to establish a kinetic model for alumina ceramics. Two sintering atmospheres, air, and argon, were selected for the degreasing tests at 100°C–700°C. The reaction products and mass changes of alumina ceramics were analyzed by TG‐FTIR and TG‐DSC (heating rates of 5, 10, and 15°C/min, respectively). Meanwhile, Boswell, Friedman, Ozawa, and DAEM model was used to describe the nonisothermal kinetics of the SLA alumina ceramic degreasing process. The results showed that setting the holding time to 400°C–425°C could promote the slow release of heat from the alumina ceramics. The thermal degreasing stage of the ceramic generated fewer cracks in the argon atmosphere than in the air atmosphere. The corresponding average activation energy values were 105.40 kJ/mol (Boswell model), 112.48 kJ/mol (Friedman model), 108.14 kJ/mol (Ozawa model), and 101.36 kJ/mol (DAEM model). The results of the study could provide an invaluable reference for the fabrication of defect‐free SLA alumina ceramics.