薄脆饼
RGB颜色模型
材料科学
光电子学
平面的
半导体
光学显微镜
基质(水族馆)
光学
显微镜
频道(广播)
光电探测器
计算机科学
人工智能
计算机图形学(图像)
物理
扫描电子显微镜
复合材料
电信
地质学
海洋学
作者
A. А. Козырев,M. V. Goreeva,D. N. Burtsev,Yu. A. Eliseeva
出处
期刊:Journal of Optical Technology
[The Optical Society]
日期:2020-06-01
卷期号:87 (6): 379-379
标识
DOI:10.1364/jot.87.000379
摘要
It is shown that it is promising to use the RGB data of bright-field optical microscopy to efficiently monitor the surface cleanliness of the active elements of semiconductor wafers in the planar production cycle. It is demonstrated that the film thickness on a substrate surface can be determined from RGB data obtained by means of a photosensor based on a Bayer array with known spectral response. An example shows how to use it on a GaAs semiconductor wafer with metallized active gold elements. Software has been developed for channel-by-channel comparison of a discriminated region of two pictures. An algorithm is presented for obtaining micrographs that can subsequently be analyzed and compared.
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