材料科学
电子背散射衍射
微观结构
流动应力
合金
动态再结晶
冶金
应变率
扫描电子显微镜
变形(气象学)
再结晶(地质)
透射电子显微镜
复合材料
光学显微镜
退火(玻璃)
热加工
生物
古生物学
纳米技术
作者
Bo Hou Zhang,Bo Long Li,Peng Qi,Ning Li,Tong Bo Wang,Zuo Ren Nie
出处
期刊:Materials Science Forum
日期:2020-05-01
卷期号:993: 294-298
标识
DOI:10.4028/www.scientific.net/msf.993.294
摘要
In this paper, an Al-Zn-Mg-Cu alloy with a small amount of Er and Zr added was used as the research object. The homogenization annealing was carried out, and the 7N01 aluminum alloy was used at 300 °C, 350 °C, 400 °C, 450 °C and 0.1 s -1 , 1 s -1 , 10 s -1 deformation conditions by Gleeble-3500 thermal simulator. Optical Microscopy (OM), Scanning Electron Microscopy (SEM), Electron Backscatter Diffraction (EBSD) and Transmission Electron Microscopy (TEM) were used for microstructure analysis. The results show that the stress-strain curve of with Er 7N01 aluminum alloy can be divided into micro-strain stage, uniform deformation stage and steady-state flow stage during the thermal compression process. The flow stress of 7N01 aluminum alloy achieved peaks at the initial stage of strain, and then increased with the increase of strain rate and the decrease of deformation temperature. With the increase of deformation temperature and the decrease of deformation rate, the recrystallization process was significantly increased.
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