铆钉
材料科学
接头(建筑物)
胶粘剂
复合材料
搭接接头
结构工程
GSM演进的增强数据速率
极限抗拉强度
数字图像相关
合金
计算机科学
工程类
电信
图层(电子)
作者
Guangyong Sun,Xuguang Xia,Xinglong Liu,Quantian Luo,Qing Li
标识
DOI:10.1016/j.tws.2021.107657
摘要
This paper reports an experimental investigation into mechanical behaviors and failure mechanisms of different joint methods for dissimilar materials, including adhesive joints, rivet joints, and hybrid joints with adhesive and rivet. In this study, a series of quasi-static tensile tests were conducted for different joint methods. The digital image correlation (DIC) technique was used to scrutinize the deformation and failure process in situ in real time. The failure modes were identified through macro-/microscopic analyses. The effects of rivet directions and filling enhancement on the joint behavior were characterized by means of experimental and theoretical methods. The results indicated that the hybrid connection exhibited the best mechanical characteristics among these three types of joints. Importantly, an interactive enhancement effect between the rivet and adhesive was identified in the hybrid joints. It was further found that the filling adhesive in a preformed hole of the substrate could better disperse the stress around it and effectively reduce the stress concentration near the hole edge. This paper provides some new insights into the design of different joint methods for dissimilar materials through a comparative study, which exhibits considerable potential and credibility for applying hybrid joints in engineering practice.
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