介电常数
热导率
材料科学
介电常数
电导率
热的
工程物理
复合材料
电介质
光电子学
物理
热力学
量子力学
作者
Xiaodi Dong,Jun‐Wei Zha
标识
DOI:10.1088/1361-6463/ad4a83
摘要
Abstract The continuous upgrading of electronic technology has facilitated the integration and miniaturization of electronic and electrical equipment, as well as putting great pressure on the multifunctional demand for internal materials. Developing insulating materials with both low permittivity and high thermal conductivity has become imperative. This perspective focuses on polyimide (PI), which is the top material of the polymer material pyramid, discusses the characteristic parameters that affect its dielectric property and thermal conductivity. A series of basic schemes to regulate the dielectric/thermal properties of PI are summarized, revealing the bottlenecks and drawbacks of the current research. Future development trends of PIs featured low permittivity-high thermal conductivity are anticipated, and novel ideas are proposed for the development of new generation of multifunctional PIs.
科研通智能强力驱动
Strongly Powered by AbleSci AI