Monolithic integration of various-type III-V epitaxial structures on silicon-photonics platform using chip-on-wafer hydrophilic bonding process

Direct bonding of InP active regions on a Si waveguide circuit is demonstrated using chip-on-wafer hydrophilic bonding process, and PL spectra from different epitaxial structures are verified. Using this process, the stable operation of hybrid lasers is obtained after an aging test over 2500 hours.