钝化
化学
铜
氧化物
硼砂
氢氧化物
无机化学
金属
缓冲器(光纤)
缓冲溶液
分析化学(期刊)
氧化铜
阴极保护
极化(电化学)
图层(电子)
电化学
电极
物理化学
原材料
计算机科学
有机化学
电信
色谱法
作者
Hans‐Henning Strehblow,B. Titze
标识
DOI:10.1016/0013-4686(80)90036-5
摘要
The passive behaviour of copper is examined in weakly acid and alkaline solutions. The current peaks of the potentiodynamic polarization curves are related to the formation and reduction of passivating oxide layers. These layers have been examined by ESCA and ISS. A duplex structure of the oxide is found with copper I oxide at the metal surface covered by copper II hydroxide for sufficiently positive potentials. The thickness of the anodically formed oxide is deduced from the charges of cathodic reduction in phosphate buffer pH = 7.0 and 8.0 and borax buffer pH = 9.2. 10 to 14 Å of Cu2O are found for the three buffer solutions not changing decisively with the potential of passivation. The thickness of the covering Cu(OH)2 is increasing with the potential in the range of 0.30 VH to 1.20 VH up to 33, 23, and 19Å in the buffer solutions pH = 7.0, 8.0, and 9.2, respectively. From the increase of the thickness of the Cu(OH)2 layer with the potential an electrical field strength of ∼ 5
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