Preparation and Property of Copper Electronic Pastes

Low temperature and air curing copper electronic pastes were prepared mainly by mixing micron-sized copper powders as conductive filler and epoxy resin as base material.Also added during the mixing were L-ascorbic acid,PVP and polyamide resin as reducing agent,dispersant and the curing agent,respectively.The performances of the electronic pastes were characterized by X-ray diffraction(XRD),metallographic microscope(OA),four point probe resistance tester and viscosity test.Results show that when the ratio of copper and organic carrier was 85∶15,and dryed at 75℃ in an oven,the conductive copper film exhibited the best performance:The resistivity was stable and reached 3.627#10-3Ω·cm;The sample had less porocity and smooth surface.