四平无引线包
温度循环
芯片级封装
倒装芯片
可靠性(半导体)
动力循环
炸薯条
参数统计
集成电路封装
可靠性工程
材料科学
工程类
电气工程
功率(物理)
热的
复合材料
胶粘剂
物理
统计
数学
图层(电子)
量子力学
气象学
作者
Ke Xue,Dong Lu,Kai Chen,Yijing Qin,Dayang Li,Qi Tang
出处
期刊:International Conference on Electronic Packaging Technology
日期:2021-09-14
被引量:1
标识
DOI:10.1109/icept52650.2021.9567718
摘要
In this work, finite element analysis and failure analysis are performed to analyze the crack failure in flip chip quad flat no-lead (Flip Chip QFN). Although a QFN is a traditional package, the reliability requirements of Flip Chip QFN in power applications have become strict and more and more challenging to meet. This paper elaborates the thermomechanical reliability challenges of Flip Chip QFN associated with its unique package construction features, and investigate the failure mechanisms of package cracking issue found in thermal cycling test. Parametric analysis is conducted to determine the optimal design in the Flip Chip QFN to combat crack failure. This investigation can help improve the product reliability by preventing crack failures in the Flip Chip QFN package.
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