Relationships in a bismaleimide resin system. Part I: Cure mechanisms

Abstract A series of bismaleimide resin systems has been examined in order to identify the molecular features responsible for the mechanical response of these materials. A range of network structures was produced both by formulation of resins with different ratios of N,N′‐bismaleimido‐4,4′‐diphenylmethane (BMI) and methylene dianiline (MDA), and by the use of different thermal processing cycles. Spectrographic and chromatographic techniques were used to study the reactions that occurred during the cure. Two principal reactions were confirmed: a Michael addition reaction which provides linear chain growth, and an addition reaction which produces crosslinking through the double bonds of the maleimide group. In general, curing at a lower temperature or increasing the MDA content served to favor chain extension over crosslinking, which might be expected to increase molecular mobility in the resin.