Low‐dielectric and low‐temperature curable fluorinated nano carbon/polyimide composites with 6‐aminoquinoline for end capping

Abstract One challenge in the high‐performance dielectric material of polyimide (PI) is to obtain the excellent comprehensive properties at low curing temperature for advanced IC package. In this work, 6‐aminoquinoline (AQL) is introduced through covalent bonds for end capping to obtain a low‐temperature curable PI at first. The results demonstrate that with very limited introduce (2.76%) of AQL, the imidization index could reach as high as 1.01 at 200°C. Then, fluorinated nano carbon (FC) is further introduced resulting in the fluorinated nano carbon/polyimide (FCPI) composites, which effectively reduces the dielectric constant (1 wt%, 2.75 @ 1 MHz). Besides, the as‐prepared FCPIs also possess excellent thermal property of which FCPI‐0.3 exhibited the 5% weight loss temperature of 540°C and the glass transition temperature is also as high as 385°C. Furthermore, the tensile strength of the film is 127 MPa, the elongation at break is around 15.82%, and the Youngs' modulus is about 3.10 GPa proving the superior mechanical property. As a result, the successful preparation of the FCPI nanocomposites not only possess low‐temperature curing and low‐dielectric performance but also exhibit excellent thermal and mechanical properties, which shows a wide range of application prospects in the field of microelectronics for the advanced electronic package.