电镀
材料科学
复合数
铜
镀铜
电镀(地质)
冶金
锂(药物)
能量密度
铝
化学镀
离子
镀金(软件工程)
复合材料
化学
工程物理
图层(电子)
医学
管理
有机化学
内分泌学
地球物理学
经济
工程类
地质学
作者
Xuanle Chen,Xuekun Zeng,Shiyu Li,Nan Ye,Zhan Yu,Ziyi Gong,Jiancheng Tang,Haiou Zhuo
标识
DOI:10.1016/j.apsusc.2024.159804
摘要
Copper-aluminum composite foils have the advantages of excellent electrical and mechanical properties, lightweight, and low cost. However, overcoming the equipment limitations of physical preparation methods to produce ultra-thin copper-aluminum composite foils with outstanding properties has been a challenge. Herein, smooth-faced, dense, and tightly bonded copper-aluminum composite foils are prepared using a combination of electroless plating and electroplating. This process involves the use of tin and nickel as transition layers, followed by electroplating the copper-clad layer. Ultra-thin copper-aluminum composite foils with a copper layer thickness ranging from 0.5 to 7 μm and a minimum square resistance of 4.6 mΩ can be prepared with a mass of 36.7%-70% of that of pure copper foils of the same thickness. These foils are expected to be used in a variety of energy storage components that require extreme lightweight.
科研通智能强力驱动
Strongly Powered by AbleSci AI