腐蚀
醋酸
Pourbaix图
溶解
材料科学
扫描电子显微镜
化学工程
电化学
冶金
复合材料
化学
电极
有机化学
工程类
物理化学
作者
Achim Kraft,Lutz Labusch,Tobias Ensslen,I. Dürr,Jonas Bartsch,Markus Glatthaar,Stefan W. Glunz,Holger Reinecke
出处
期刊:IEEE Journal of Photovoltaics
日期:2015-05-01
卷期号:5 (3): 736-743
被引量:97
标识
DOI:10.1109/jphotov.2015.2395146
摘要
In this paper, the corrosion mechanism behind damp heat-induced degradation of screen-printed silver front-side contacts of silicon solar cells due to the presence of acetic acid, which is known to be a decomposition product of the most common module encapsulation material ethylene vinyl acetate, is investigated. Scanning electron microscope (SEM) investigations and solder and peel-tests show that the interaction between screen-printed contacts and acetic acid results in a significant adhesion loss of the front-side metallization due to the corrosion of the glass layer inside the contacts. The application of a reductive potential to the front contact accelerates this process considerably and enables it at lower acetic acid concentrations. The analysis of the dissolved corrosion products of the contact (lead, silver) by chemical trace analysis (inductively coupled plasma optical emission spectrometry) and the generation of Pourbaix diagrams of lead in acetic acid enable the elaboration of a detailed model, which suggests a cycle of dissolution and subsequent reduction of the dissolved species as the mechanism behind the corrosion of the contacts in the model experiment and most probably in module application. Cyclic voltammetry measurements with acetic acid dipping solutions support this conclusion.
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