General failure analysis techniques for packaged LED

LEDs are increasing applied in different areas rapidly due to their beneficial characteristics over their predecessors, and this also led to new failure modes under different environmental conditions. To understand these complex failure modes, in-depth knowledge of various failure analysis techniques must be performed. This chapter aims to provide a base for various failure analysis techniques ranging from nondestructive to destructive, depending on the failure mode. Case studies for each analysis technique are also presented to ease understanding and the rationales for their use are also presented.