散热片
材料科学
热电冷却
硫系化合物
热电发电机
热电效应
消散
三元运算
传热
发热
热电材料
光电子学
机械工程
热导率
复合材料
计算机科学
热力学
工程类
物理
程序设计语言
作者
Keonkuk Kim,Seungjun Choo,Jungsoo Lee,Hyejin Ju,S.J. Jung,Seungki Jo,So‐Hyeon Lee,Seongheon Baek,Juyoung Kim,Kyung Tae Kim,Han Gi Chae,Jae Sung Son
标识
DOI:10.1002/advs.202402934
摘要
Abstract Thermoelectric devices have received significant attention because of their potential for sustainable energy recovery. In these devices, a thermal design that optimizes heat transfer and dissipation is crucial for maximizing the power output. Heat dissipation generally requires external active or passive cooling devices, which often suffer from inevitable heat loss and heavy systems. Herein, the design of heat‐sink integrated thermoelectric legs is proposed to enhance heat dissipation without external cooling devices, realized by finite element model simulation and 3D printing of ternary silver chalcogenide‐based thermoelectric materials. Owing to the self‐induced surface charges of the synthesized AgBiSe 2 (n‐type) and AgSbTe 2 (p‐type) particles, these particle‐based colloidal inks exhibited high viscoelasticity, which enables the creation of complex heat‐dissipation architectures via 3D printing. Power generators made from 3D‐printed heat‐dissipating legs exhibit higher temperature differences and output power than traditional cuboids, offering a new strategy for enhancing thermoelectric power generation.
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