纳米技术
等离子体
数码产品
等离子体处理
介质阻挡放电
材料科学
生化工程
计算机科学
工程类
电介质
光电子学
电气工程
物理
量子力学
作者
Thu Minh Nguyen,Neha Kaushik,Tung T. Nguyen,Eun Ha Choi,Linh Nhat Nguyen,Nagendra Kumar Kaushik
出处
期刊:Materials today electronics
日期:2023-12-27
卷期号:7: 100087-100087
被引量:7
标识
DOI:10.1016/j.mtelec.2023.100087
摘要
Flexible dielectric barrier discharge (FXDBD) plasma devices have received extensive attention for the surface treatment of larger areas, nonflat surfaces, or curved objects. The rapid development of flexible electronics technology allows unrestricted versatility for designing and manufacturing FXDBD devices. The flexible structure of FXDBD plasma opens new possibilities that cannot be effectively achieved by conventional rigid-body plasma systems, particularly in treating complex surface structures in biological targets. Over the last decade, FXDBD plasma devices have been broadly utilized for surface sterilization, wound solutions, and food processing applications. This review provides a comprehensive overview of current advances in FXDBD plasma, considering important aspects of manufacturing processes and critical application accomplishments. The challenges and perspectives for the future development of FXDBD plasma are also discussed.
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