苯并菲
电导率
热传导
接受者
材料科学
金属
金属有机骨架
电荷(物理)
化学物理
电阻率和电导率
分子
平面(几何)
导电体
载流子
化学
凝聚态物理
光电子学
物理化学
几何学
复合材料
物理
有机化学
量子力学
冶金
吸附
数学
作者
Ashok Yadav,Shiyu Zhang,Paola A. Benavides,Wei Zhou,Sourav Saha
标识
DOI:10.1002/anie.202303819
摘要
Abstract Two‐dimensional graphitic metal–organic frameworks (GMOF) often display impressive electrical conductivity chiefly due to efficient through‐bond in‐plane charge transport, however, less efficient out‐of‐plane conduction across the stacked layers creates large disparity between two orthogonal conduction pathways and dampens their bulk conductivity. To address this issue and engineer higher bulk conductivity in 2D GMOFs, we have constructed via an elegant bottom‐up method the first π‐intercalated GMOF (iGMOF1) featuring built‐in alternate π‐donor/acceptor (π‐D/A) stacks of Cu II ‐coordinated electron‐rich hexaaminotriphenylene (HATP) ligands and non‐coordinatively intercalated π‐acidic hexacyano‐triphenylene (HCTP) molecules, which facilitated out‐of‐plane charge transport while the hexagonal Cu 3 (HATP) 2 scaffold maintained in‐plane conduction. As a result, iGMOF1 attained an order of magnitude higher bulk electrical conductivity and much smaller activation energy than Cu 3 (HATP) 2 (σ=25 vs. 2 S m −1 , E a =36 vs. 65 meV), demostrating that simultaneous in‐plane (through‐bond) and out‐of‐plane (through πD/A stacks) charge transport can generate higher electrical conductivity in novel iGMOFs.
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