材料科学
刮伤
脆性
复合材料
缩进
结构工程
机械
物理
工程类
作者
Yuhua Huang,Yuqi Zhou,Jinming Li,Fulong Zhu
标识
DOI:10.1016/j.ijmecsci.2022.107719
摘要
Multi modes features during machining of brittle materials determine the process window. To reveal these fundamental features of SiC, a series of scratching experiments and atomistic simulations were designed. Real-time signals of scratching force and acoustic emission were analyzed in the time-domain and time-frequency domains to distinguish features. The birefringence of 4H-SiC in polarized light was non-destructively deployed to analyze the localized stress distribution and morphology after scratching. The experiments found four scratching modes – Hertz mode, quasi-ductility mode, high stress mode, and stylus failure mode. To reveal the atom-level behaviors inducing mode transition, atomistic simulations were conducted and post-analyzed from macro-level parameters, phase transition, dislocations, and so forth. The dynamic cycle mechanism – elastic deformation, plastic deformation, cracking – was revealed and the shear modulus, poisson's ratio, scratching speed, penetration depth, and deformation energy was recommended to optimize analytical model. Finally, we attempted to propose a unified qualitative multi layers model to explain different material removal mechanisms.
科研通智能强力驱动
Strongly Powered by AbleSci AI