Spontaneous Wetting Induced by Contact‐Electrification at Liquid–Solid Interface

材料科学 润湿 接触带电 接口(物质) 接触角 固体表面 润湿转变 工程物理 纳米技术 复合材料 摩擦电效应 化学物理 坐滴法 物理 工程类
作者
Zhen Tang,Dan Yang,Hengyu Guo,Shiquan Lin,Zhong Lin Wang
出处
期刊:Advanced Materials [Wiley]
卷期号:36 (25): e2400451-e2400451 被引量:72
标识
DOI:10.1002/adma.202400451
摘要

Wettability significantly influences various surface interactions and applications at the liquid-solid interface. However, the understanding is complicated by the intricate charge exchange occurring through contact electrification (CE) during this process. The understanding of the influence of triboelectric charge on wettability remains challenging, especially due to the complexities involved in concurrently measuring contact angles and interfacial electrical signals. Here, the relationship is investigated between surface charge density and change of contact angle of dielectric films after contact with water droplets. It is observed that the charge exchange when water spared lead to a spontaneous wetting phenomenon, which is termed as the contact electrification induced wetting (CEW). Notably, these results demonstrate a linear dependence between the change of contact angle (CA) of the materials and the density of surface charge on the solid surface. Continuous CEW tests show that not only the static CA but also the dynamics of wetting are influenced by the accumulation charges at the interface. The mechanism behind CEW involves the redistribution of surface charges on a solid surface and polar water molecules within liquid. This interaction results in a decrease in interface energy, leading to a reduction in the CA. Ab initio calculations suggest that the reduction in interface energy may stem from the enhanced surface charge on the substrate, which strengthens the hydrogen bond interaction between water and the substrate. These findings have the potential to advance the understanding of CE and wetting phenomena, with applications in energy harvesting, catalysis, and droplet manipulation at liquid-solid interfaces.
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