材料科学
六甲基二硅氧烷
等离子体增强化学气相沉积
腐蚀
复合材料
盐雾试验
粘附
丙烯酸酯
薄膜
纳米
热稳定性
化学工程
聚合物
纳米技术
等离子体
物理
工程类
单体
量子力学
作者
Liting Wu,Luqi Liu,Fuliang Ma,Luli Shen,Gang Wang,Zhixiang Zeng,Xuedong Wang
出处
期刊:Surface topography
[IOP Publishing]
日期:2023-01-24
卷期号:11 (1): 015009-015009
标识
DOI:10.1088/2051-672x/acb1ca
摘要
Abstract The high-reliability requirement of 5 G electronic products poses a higher challenge to its protective films, the high transmission quality of high-frequency signals, excellent heat dissipation and anticorrosive capability, which promotes the ultra-thin protective films with good adhesion and anticorrosion. In this work, a nanometer-scale p-HMDSO film was obtained on the Cu alloy with hexamethyldisiloxane (HMDSO) as the precursor by the low-temperature RF-PECVD method. Compared with Parylene and p-PFDA (1H, 1H, 2H, 2H-Perfluorodecyl acrylate) films, the p-HMDSO film possesses better hydrophobicity, mechanical stability and anticorrosive property. The corrosion inhibition efficiency of the p-HMDSO film reaches 99.95%. Meanwhile, it provides 3 orders of magnitude increment of charge-transfer impedance, a salt spray corrosion resistance for 24 h, and the protection of 10 days in the 3.5 wt% NaCl solution, which develops a better application prospect in the protection of integrated electronics.
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