热膨胀
材料科学
聚酰亚胺
Kapton
聚合物
复合材料
各向异性
制作
薄膜
电容
光学
纳米技术
物理
病理
物理化学
化学
医学
替代医学
图层(电子)
电极
作者
Hua-Ching Tong,H. K. D. Hsuen,K. L. Saenger,G. W. Su
摘要
A highly sensitive capacitance-change technique, suitable for thin polymer films, has been developed for the measurement of the coefficient of thermal expansion (CTE) in the film-thickness direction. Using this technique, we have determined the thickness-direction CTE of Kapton polyimide to be about 81±4 ppm/°C, averaged over the temperature range 50–150 °C. This polymer was chosen because it is widely used in the electronics industry for the fabrication of flexible printed circuits. Two other techniques, a Fabry–Perot laser interferometric technique, and the more conventional but less sensitive thermomechanical analysis, were also investigated. The thickness-direction CTEs obtained from the three techniques were at least a factor of 2.4 greater than the in-plane CTE of about 34±2 ppm/°C. The in-plane CTE, found here via simple length measurements, was in good agreement with literature values. It is speculated that the CTE anisotropy observed might be due to the in-plane molecular orientation of the polymer chains.
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