Flexible Embedded Metal Meshes by Sputter-Free Crack Lithography for Transparent Electrodes and Electromagnetic Interference Shielding

A facile and novel fabrication method is demonstrated for creating flexible poly(ethylene terephthalate) (PET)-embedded silver meshes using crack lithography, reactive ion etching (RIE), and reactive silver ink. The crack width and spacing in a waterborne acrylic emulsion polymer are controlled by the thickness of the polymer and the applied stress due to heating and evaporation. Our innovative fabrication technique eliminates the need for sputtering and ensures stronger adhesion of the metal meshes to the PET substrate. Crack trench depths over 5 μm and line widths under 5 μm have been achieved. As a transparent electrode, our flexible embedded Ag meshes exhibit a visible transmission of 91.3% and sheet resistance of 0.54 Ω/sq as well as 93.7% and 1.4 Ω/sq. This performance corresponds to figures of merit (σ