耗散因子
电介质
压电
材料科学
电容器
微电子机械系统
机电耦合系数
薄膜
分析化学(期刊)
光电子学
纳米技术
电气工程
化学
复合材料
有机化学
工程类
电压
作者
Andrea Mazzalai,Bernd Heinz
标识
DOI:10.1109/ultsym.2018.8579890
摘要
The enhancement of the electromechanical coupling coefficient caused by Sc substitution in AlN-based piezoelectric MEMS devices can be exploited successfully only if the dielectric losses remain confined to low values. While the magnitude of the piezoelectric activity in Al 1-x Sc x N thin films has been described widely in the literature, the impact of the Sc content on the loss tangent has not been studied extensively. In this work we discuss the dissipation factor obtained for x=0.095 and x=0.3 on Mo and Pt bottom electrodes, for full capacitor stacks deposited with an EVATEC Clusterline ® 200-II PVD tool equipped with single alloy targets 304mm in diameter.
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