Molecular-level characterization of changes in the mechanical properties of wood in response to thermal treatment

纤维素 半纤维素 材料科学 复合材料 木质素 傅里叶变换红外光谱 韧性 热稳定性 热处理 极限抗拉强度 结晶度 脆性 化学工程 化学 有机化学 工程类
作者
Dong Wang,Feng Fu,Lanying Lin
出处
期刊:Cellulose [Springer Science+Business Media]
卷期号:29 (6): 3131-3142 被引量:26
标识
DOI:10.1007/s10570-022-04471-3
摘要

Thermal treatment can improve the dimensional stability of wood, but it also decreases wood’s toughness, or increases its brittleness. In this paper, combining FTIR spectroscopy and mechanical analysis were used to monitor wood molecular straining and deepen the micromechanical understanding of thermally-treated wood. The degradation of hemicellulose increased as the thermal treatment temperature increase, and the 220 °C treatment also led to cellulose microfibrils reorientation. The results of static tension FTIR spectra of thermally-treated wood indicated that the absorption peak of cellulose glycosidic bond underwent a substantial bandshift to lower wave numbers as the tensile strain increase, but the characteristic peak position of the lignin was no obvious change during stretching. For the 160–200 °C treated samples, the bandshift ratios of cellulose C–O–C glycosidic bond increased upon increasing the temperature; Furthermore, the intensities of the two split peaks of cellulose at 1169 cm−1 and 1435 cm−1 in 0° polarization dynamic FTIR spectra decreased upon increasing the treatment temperature, indicating the elastic-like response of cellulose for thermally-treated wood decrease. For the 220 °C treated sample, the bandshift ratio of cellulose glycosidic bond decreased compared with other thermal treatment samples, but the intensities of the two split peaks of cellulose increased again. Those results indicated that the shear slipping between cellulose microfibrils decrease and microfibrils reorientation due to hemicellulose degradation after thermal treatment may cause the toughness of the thermally-treated wood decrease, or the brittleness increase.
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