蚀刻(微加工)
腐蚀
形态学(生物学)
铜
盐(化学)
材料科学
化学工程
电化学
各向同性腐蚀
润湿
纳米技术
冶金
化学
复合材料
有机化学
图层(电子)
物理化学
电极
工程类
生物
遗传学
作者
Wenwen Dou,Jiajia Wu,Tingyue Gu,Peng Wang,Dun Zhang
标识
DOI:10.1016/j.corsci.2017.11.012
摘要
A super-hydrophobic (SH) CuO surface was prepared on copper using chemical etching followed by fluorination treatment. The relationship between surface morphology and hydrophobicity was investigated. When the etching time varied from 5 to 120 min, morphology changed from sparse sharp needles to dense sharp needles, and then to a stamen-like structure with flower-like clusters. All these surfaces were SH with the dense micro-needle surface (10 min etching) the best. This SH surface made salt (NaCl) particles deliquesce and roll away. Electrochemical tests showed that it reduced corrosion in a 3.5% (w/w) NaCl solution by more than 102 times.
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