环氧树脂
氧化还原
粘附
辐照
材料科学
接触角
铜
紫外线
复合材料
表面改性
真空紫外
化学
化学工程
光学
光电子学
冶金
物理
工程类
物理化学
核物理学
作者
Satoshi Endo,Akira Shimizu,K. Fukada
标识
DOI:10.23919/icep61562.2024.10535590
摘要
We evaluated the adhesion strength between epoxy and copper by applying vacuum ultraviolet light treatment to epoxy resin as a pretreatment for medium vacuum sputtering. In order to increase the concentration of hydroxyl groups on the resin surface, we replaced the VUV light irradiation atmosphere with a reducing gas and redox gas and evaluated the contact angle and adhesion. The VUV-Redox method generated COH groups on the epoxy resin surface, improving the adhesion strength at the interface between the epoxy resin and copper.
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