钝化
薄脆饼
材料科学
像素
数码产品
可穿戴技术
计算机科学
光电子学
纳米技术
可穿戴计算机
电气工程
人工智能
嵌入式系统
工程类
图层(电子)
作者
Vineeth Kumar Bandari,Oliver G. Schmidt
标识
DOI:10.1038/s41377-024-01683-z
摘要
Abstract The development of GaN-based Micro-LED arrays achieving brightnesses exceeding 10 7 nits and high-density micro-displays with up to 1080×780 pixels marks a true breakthrough in the field. This breakthrough is a result of mastering a combination of long-standing challenges comprising wafer-scale high-quality epitaxial growth, sidewall passivation, efficient photon extraction, and elegant bonding technologies, and promises significant advantages for augmented and virtual reality devices, wearables, and next-generation consumer electronics.
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