可靠性(半导体)
可靠性工程
过程(计算)
半导体器件制造
质量(理念)
薄脆饼
数码产品
计算机科学
工艺优化
CMOS芯片
制造工程
工程类
电子工程
电气工程
认识论
操作系统
物理
环境工程
哲学
量子力学
功率(物理)
作者
Qiao Teng,Yongkang Hu,Ran Cheng,Yongyu Wu,Guodong Zhou,Dawei Gao
标识
DOI:10.1016/j.mee.2023.112086
摘要
With the development of automotive electronics, the characteristics of device reliability have received widespread attention. The improvement of device reliability primarily depends on the manufacturing process's quality. This work reviews the inherent relationship between manufacturing processes and reliability with a detailed introduction to the components and failure indices of wafer-level reliability testing. Furthermore, it focuses on the complementary metal-oxide-semiconductor (CMOS) manufacturing process and how device reliability can be enhanced through optimization in front-end-of-line and back-end-of-line processes. Reliability serves as a crucial indicator of device quality, and further efforts are required to achieve higher reliability through process optimization.
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