电磁屏蔽
材料科学
电子设备和系统的热管理
消散
纳米复合材料
电磁干扰
导电体
导电的
干扰(通信)
复合材料
机械工程
电信
物理
计算机科学
频道(广播)
工程类
热力学
作者
Yue Sun,Yunting Su,Ziyuan Chai,Lei Jiang,Liping Heng
标识
DOI:10.1038/s41467-024-51732-9
摘要
In the era of 5 G, the rise in power density in miniaturized, flexible electronic devices has created an urgent need for thin, flexible, polymer-based electrically and thermally conductive nanocomposites to address challenges related to electromagnetic interference (EMI) and heat accumulation. However, the difficulties in establishing enduring and continuous transfer pathways for electrons and phonons using solid-rigid conductive fillers within insulative polymer matrices limit the development of such nanocomposites. Herein, we incorporate MXene-bridging-liquid metal (MBLM) solid-liquid bi-continuous electrical-thermal conductive networks within aramid nanofiber/polyvinyl alcohol (AP) matrices, resulting in the AP/MBLM nanocomposite with ultra-high electrical conductivity (3984 S/cm) and distinguished thermal conductivity of 13.17 W m
科研通智能强力驱动
Strongly Powered by AbleSci AI