Lv5
910 积分 2023-11-08 加入
Fabrication of Polyimide Nano-Particles by Precipitation Polymerization
7天前
已完结
Cure Process Impact on Cure Time and Properties of Low Temperature Polyimide for 3D Stacking Applications
10天前
已完结
(Invited) Fan-out and Cu- Compatible Dielectric Processing of Low Temperature Polyimides for Next-Generation 3D Advanced IC Back End Applications
12天前
已关闭
Molecular Chain Flexibility and Dielectric Loss at High-Frequency: Impact of Ester Bond Arrangement in Poly(ester imide)s
12天前
已完结
Reducing Intermolecular Friction Work: Preparation of Polyimide Films with Ultralow Dielectric Loss from MHz to THz Frequency
14天前
已完结
A systematic study of the relationship between the high-frequency dielectric dissipation factor and water adsorption of polyimide films
14天前
已完结
A Facile Strategy for Intrinsic Low-Dk and Low-Df Polyimides Enabled by Spirobifluorene Groups
14天前
已完结
Novel Photo-definable Low Dk & Df Polyimide for Advanced Package of High Frequency Application
14天前
已完结
Test Methods for Kinetic Parameters by Factor Jump/Modulated Thermogravimetry
25天前
已完结
Advanced Packaging Technology Platforms for Chiplets and Heterogeneous Integration
25天前
已完结
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