Microstructure and Phase Transformation Behavior of NiTiCu Shape Memory Alloys Produced Using Twin-Wire Arc Additive Manufacturing

微观结构 材料科学 等轴晶 形状记忆合金 钛镍合金 合金 冶金 相(物质) R相 马氏体 无扩散变换 三元运算 复合材料 压痕硬度 化学 有机化学 计算机科学 程序设计语言
作者
Long Chen,J.P. Oliveira,Yan Xi,Bowen Pang,Wenchao Ke,Jiajia Shen,Fissha Biruke Teshome,Norbert Schell,Naixun Zhou,Bei Peng,Zhi Zeng
标识
DOI:10.1016/j.amf.2024.200132
摘要

NiTiCu thin walls were produced by twin-wire arc additive manufacturing (T-WAAM) using commercial NiTi and Cu wires as the feedstock materials. This approach aims to solve the problems typically associated with large phase transformation hysteresis in NiTi shape memory alloys. The microstructure, mechanical properties, and phase transformation behavior of the as-deposited NiTiCu alloy were comprehensively examined. The results revealed that the as-deposited NiTiCu alloy was well-formed, with its microstructure showed columnar, equiaxed, and needle-like grains, depending on the location within the deposited walls. The microhardness gradually increased from the first to the third layer. The Cu content was 20.80 at%, and Cu-based precipitates were formed in the as-deposited NiTiCu. The volume fractions and lattice parameters of the matrix and precipitates in the as-deposited NiTiCu material were analyzed using high-energy synchrotron X-ray diffraction. The martensitic phase was identified as a B19 crystal structure, and the as-deposited NiTiCu underwent a one-step B2-B19 phase transformation. The tensile strength and fracture strain were approximately 232 MPa and 3.72%, respectively. In particular, the addition of Cu narrowed the phase transformation hysteresis of the as-deposited NiTiCu alloy from 24.4 to 7.1 ℃ compared with conventional binary NiTi alloys. This study expands the potential of T-WAAM in modifying the phase transformation behavior of NiTi-based ternary alloys.
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