材料科学
聚二甲基硅氧烷
复合材料
固化(化学)
弹性体
胶粘剂
下降(电信)
刚度
可伸缩电子设备
模数
苯并环丁烯
数码产品
聚合物
机械工程
物理化学
化学
工程类
图层(电子)
作者
Naser Naserifar,Saigopalakrishna S. Yerneni,Lee E. Weiss,Gary K. Fedder
标识
DOI:10.1002/marc.201900569
摘要
Abstract Rapid prototyping of thin, stretchable substrates with engineered stiffness gradients at desired locations has potential impact in the robustness of skin‐wearable electronics, as the gradients can inhibit cracking of interconnect and delamination of embedded electronic chips. Drop‐on‐demand inkjetting of thinned polydimethylsiloxane (PDMS) curing agent onto a spin‐cast 80 µm‐thick 20:1 (base: curing agent) PDMS substrate sets the elastic modulus of the subsequently cured film with sub‐millimeter accuracy. The inkjet process creates digitally defined stiffness gradient spans as small as 100 µm for single droplets. Varying the drop density results in differences in elastic modulus of up to 80%. In jetting tests of curing agent into pure base PDMS, a continuous droplet spacing of 100 µm results in smooth lines with total widths of 1 mm and a curing agent gradient span of ≈300 µm. Release of freeform mesh elastomer microstructures by removing the uncured base after selective jetting of curing agent into pure base PDMS results in structural line width resolution down to 500 µm.
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