Synergistic effects of oriented AlN skeletons and 1D SiC nanowires for enhancing the thermal conductivity of epoxy composites

As electronic devices are moving towards miniaturization and integration, the demand for ceramic/polymer composites with high thermal conductivity (TC) are increasing significantly. Herein, we reported a novel idea for rational design and delicate construction of anisotropic three-dimensional thermally conductive networks via the ice template method, using stearic acid-modified AlN particles (AlNm) as the primary filler and SiC nanowires (SiCNWs) as the secondary. As predicted, the as-prepared epoxy (EP)-based composites achieved a maximum TC of 2.56 W·m−1·K−1 in vertical direction at a filling fraction of 55 vol %, which was 12.8 times higher than that of pure EP. More importantly, the enhancement mechanism of composite TC was further demonstrated by realistic heat transfer process and finite element simulations. Furthermore, the prepared composites also displayed excellent thermal stability, high mechanical strength and good dielectric property, indicating that this strategy provides a promising insight for the design of high-performance thermal interface materials (TIMs).