抛光
半径
钥匙(锁)
压缩(物理)
化学机械平面化
工作(物理)
有限元法
过程(计算)
计算机科学
机械工程
压力(语言学)
工程制图
材料科学
结构工程
工程类
复合材料
语言学
哲学
计算机安全
操作系统
作者
Ri Pan,Zhenzhong Wang,Chunjin Wang,Yinbiao Guo,Dongxu Zhang
出处
期刊:中國機械工程學刊
日期:2012-10-01
卷期号:33 (5): 373-382
被引量:2
标识
DOI:10.29979/jcsme.201210.0001
摘要
Bonnet polishing tool is widely used in rough polishing and fine polishing because of its own features. Ranges of key technological parameters are different in various polishing stages, which related to how the key technological parameters affect the polishing process. In this paper, series of simulations to illustrate the interaction effect of bonnet into work-piece surface using ANSYS are present, aims to get the optimal key technological parameters in rough polishing and fine polishing. It found that the inner pressure of bonnet, the height of bonnet compression, the slant angle of bonnet and bonnet radius are the main factors that influence the features of contacting area, moreover, the former two parameters directly determine the contribution of stress in contacting area. Finally, based on the simulated results, key technological parameters selected are roughly discussed according to the purpose of different polishing stages.
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