微观结构
材料科学
可靠性(半导体)
旋节分解
复合材料
相(物质)
热力学
物理
功率(物理)
有机化学
化学
作者
Zhiheng Huang,Zhiyong Wu,Hua Xiong,Yucheng Ma
出处
期刊:Proceedings
日期:2012-11-01
卷期号:39791: 44-49
标识
DOI:10.31399/asm.cp.istfa2012p0044
摘要
Abstract Microstructure and its effect on mechanical behavior of ultrafine interconnects have been studied in this paper using a modeling approach. The microstructure from the processes of solidification, spinodal decomposition, and grain growth in ultrafine interconnects has highlighted its importance. The size, geometry and composition of interconnects as well as the elastic energy can influence microstructure and thus the mechanical behavior. Quantification of microstructure in ultrafine interconnects is a necessary step to establish the linkage between microstructure and reliability.
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