Structure, chain orientation, and properties in thin films of aromatic polyimides with various chain rigidities

聚酰亚胺 BPDA公司 材料科学 高分子化学 刚度(电磁) 二胺 聚合物 结晶学 化学 复合材料 图层(电子)
作者
Moonhor Ree,K. Kim,Seung Hyo Woo,Heesook Chang
出处
期刊:Journal of Applied Physics [American Institute of Physics]
卷期号:81 (2): 698-708 被引量:172
标识
DOI:10.1063/1.364210
摘要

Several high temperature polyimides, as model polymers with various chain rigidities and chain orders, were synthesized through the polycondensation of p-phenylene diamine (PDA) with five different aromatic dianhydrides [i.e., pyromellitic dianhydride (PMDA), biphenyltetracarboxylic dianhydride (BPDA), 4,4′-oxydiphthalic anhydride (ODPA), benzophenonetetracarboxylic dianhydride (BTDA), and 4,4′-hexafluoroisopropylidenediphthalic anhydride (6F)], and investigated in terms of structure and properties. Both fully rodlike PMDA-PDA and ether-linked ODPA-PDA polyimides showed excellent orientation and poor ordering of chain in x-ray diffraction patterns, whereas both biphenyl-linked (BPDA-PDA) and carbonyl-linked (BTDA-PDA) polyimides exhibited excellent orientation and high ordering of chain. However, hexafluoroisopropylidene-linked 6F-PDA polyimide is structureless. The coherence length along the chain axis, which is a measure of chain rigidity and ordering, was estimated from (00l) peaks of x-ray diffraction patters: 6F-PDA (could not be measured) <ODPA-PDA (95 Å)<BTDA-PDA (98 Å)<BPDA-PDA (104 Å)<PMDA-PDA (130 Å). In films prepared on substrates, all polyimides were preferentially oriented in the film plane. However, the degree of molecular in-plane orientation strongly depended on the coherence length. Higher coherence length, i.e., higher chain rigidity and ordering, caused higher in-plane orientation of chains. However, the chain rigidity is more critically responsible for molecular in-plane orientation, in comparison to the chain ordering. Higher in-plane orientation of chains led to larger anisotropies of refractive indices and dielectric constants, higher in-plane modulus, lower in-plane thermal expansion coefficient, and lower residual stress.
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